Samsung unveiled its latest 2nm and 4nm process nodes and AI solutions at the Samsung Foundry Forum. The company outlined an aggressive roadmap, including 3D-ICs with logic-on-logic in 2025, custom ...

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...

This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and ...

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening ...

Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Applied Materials, Inc. is working with Apple and Texas Instruments (TI) to bolster the semiconductor manufacturing supply chain in the United States. Applied is supporting ... Semiconductor Packaging ...

ASMPT will participate in SEMICON West 2025. Under the theme "Empower the Intelligence Revolution," the company will showcase its advanced packaging portfolio on October 7–9 ... ASMPT Semiconductor ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

SEMI announced its new Conductor™ intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as part of the SEMI Supply ... SEMI announced the ...

Heraeus Electronics will exhibit at SEMICON Southeast Asia 2025, spotlighting its sustainable and high-performance solutions for advanced packaging. This year's participation ... Heraeus Electronics ...

Indium Corporation® will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held ... With its commitment to innovation ...