Abstract: Through silicon vias (TSVs) play an important role in 3-D chip integration. Effective and efficient testing for correct operation of TSVs is essential for 3-D integrated circuit design. This ...

In November 2022, Intelligencer published this story about MIT’s decision to require applicants to submit SAT and ACT scores again, two years after nearly every elite college in the country made test ...

Abstract: Math Placement Test is a common exam for fresh-entry students in the University of Technology and Applied Sciences in all the branches. Passers are exempted to study Basic Math course and to ...

Lanjigarh: Vedanta Aluminium, India’s largest producer of aluminium, through its flagship skills training initiative in Bhawanipatna, Odisha, has successfully completed the 21st batch of food & ...

Ukraine's Brave1 defense technology cluster has tested strike kamikaze drones capable of resisting electronic warfare and reaching over 40 kilometers, Digital Transformation Minister Mykhailo Fedorov ...

Russia and Ukraine have been engaging in major aerial battles, targeting energy and transportation infrastructure, as Moscow presses its fierce ground assault in the Ukrainian east in the war’s fourth ...